EMBEDDED TOROID, A MANUFACTURING METHOD THEREOF, AND A LAMINATING INTEGRATED-CIRCUIT DEVICE CAPABLE OF MEASURING CURRENTS FLOWING THROUGH A THROUGH VIA OF A 3D INTEGRATED-CIRCUIT DEVICE

摘要

PURPOSE: An embedded toroid, a manufacturing method thereof, and a laminating integrated-circuit device are provided to enable accurate measurement by directly covering an actual through via border in laminated chips of the laminating integrated-circuit device.;CONSTITUTION: A near through vias (NTSV1-NTSV4) are closely arranged on a border of a through via (TSV). A remote through vias (FTSV1-FTSV4) are remotely arranged on the border of the through via. The near through vias and the remote through vias are formed into four pairs (NFPA1-NFPA4). The near through vias and the remote through vias are connected by top wire patterns (TWP1-TWP4) and bottom wire patterns (BWP1-BWP3). A test terminal (PORT1) is connected with the top of the through via. Another test terminal (PORT2) is connected with the remote through vias.;COPYRIGHT KIPO 2013