METHOD FOR BONDING A CAP FOR AN MEMS DEVICE THROUGH EUTECTIC BONDING

摘要

PURPOSE: A method for bonding a cap for a micro electro mechanical system (MEMS) device is provided to mutually contact elements planed to form an eutectic alloy with reliability.;CONSTITUTION: A method for bonding a cap for an MEMS device (38) includes the following steps of: heating first and second bonding layers at a temperature higher than an eutectic temperature of the first and second bonding layers; applying a first force to make the first and second bonding layers compress each other; applying a second force smaller than the first force to make the first and second bonding layers compress each other; and applying a third force larger than the second force to make the first and second bonding layers compress each other.;COPYRIGHT KIPO 2013