首页> 外国专利> BARE CHIP TEST DEVICE OF A PIN-TYPE MULTI-CHIP MODULE TIGHTENING A CONNECTION PIN OF A BARE CHIP INSERTED INTO A PIN INSERTION HOLE

BARE CHIP TEST DEVICE OF A PIN-TYPE MULTI-CHIP MODULE TIGHTENING A CONNECTION PIN OF A BARE CHIP INSERTED INTO A PIN INSERTION HOLE

机译:针型多芯片模块的裸芯片测试装置,将裸芯片的连接引脚拧入引脚插入孔中

摘要

PURPOSE: A bare chip test device of a pin-type multi-chip module reduces damage to or abrasion of a pin insertion hole.;CONSTITUTION: A pin-type multi-chip module includes a printed circuit board (2), an upper plate (4), and a chip block (6). The printed circuit board is fixed on a lower through hole (1a) formed on the center of a base plate (1). The lower parts of multiple conductive metal rods (3) with a pin insertion hole at the upper side are detachably fixed to the printed circuit board in the vertical direction. The upper plate is formed above the printed circuit board, is fixed to the base plate by a vertical support rod (4a), and includes an upper through hole (4b) at the center. The chip block is fixed on the upper through hole of the upper plate to pass through vertically. The chip block inserts or mounts multiple bare chips (5) to make a vertical connection pin inserted into the pin insertion hole of the conductive metal rod protrude to the lower side.;COPYRIGHT KIPO 2013
机译:用途:针型多芯片模块的裸芯片测试设备可减少对针插入孔的损坏或磨损。;组成:针型多芯片模块包括印刷电路板(2),上板(4)和芯片块(6)。印刷电路板固定在形成在基板(1)的中央的下部通孔(1a)上。在上侧具有销钉插入孔的多个导电性金属棒(3)的下部在上下方向上装卸自如地固定在印刷基板上。上板形成在印刷电路板上方,并通过垂直支撑杆(4a)固定到基板,并且在中心处包括上通孔(4b)。芯片块固定在上板的上通孔中以垂直穿过。芯片块插入或安装多个裸芯片(5),以使插入到导电金属棒的引脚插入孔中的垂直连接引脚突出到下侧。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130107164A

    专利类型

  • 公开/公告日2013-10-01

    原文格式PDF

  • 申请/专利权人 LEADTEC CO. LTD.;

    申请/专利号KR20120029035

  • 发明设计人 LEE JONG IN;LEE JUNG WOO;

    申请日2012-03-21

  • 分类号G01R31/26;G01R31/28;

  • 国家 KR

  • 入库时间 2022-08-21 16:26:12

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