METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, CAPABLE OF IMPROVING ADHERENCE TO A STEP

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to prevent bubbles by heating a holding tape over 0.6 times higher than the melting temperature of the holding tape.;CONSTITUTION: A wafer is located on an alignment part (2). The wafer is transferred to a wafer mounting unit (3). A dicing frame (5) is located on the alignment part. The dicing frame is transferred to the wafer mounting unit. The dicing frame is received in a wafer receiving unit (6).;COPYRIGHT KIPO 2013