METHOD FOR MANUFACTURING AN IMAGE SENSOR CAPABLE OF ABSORBING UNIFORM ENERGY

摘要

PURPOSE: A method for manufacturing an image sensor is provided to improve the planarization of the back surface of a semiconductor device by forming a grid on the back surface of a workpiece.;CONSTITUTION: A workpiece (102) is provided. The workpiece comprises a front surface (106) and a back surface (108). An integrated circuit is formed on the front surface of the workpiece. A grid is formed on the back surface of the workpiece. The grid includes a conductive material.;COPYRIGHT KIPO 2013