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HYDRODYNAMIC RADIAL FLUX TOOL FOR POLISHING AND GRINDING OPTICAL AND SEMICONDUCTOR SURFACES

机译:用于抛光和研磨光学和半导体表面的水力径向通量工具

摘要

Joe fine grinding and precision polishing of flat or curved surfaces, as well as optical planarization of semiconductor and metal surfaces Useful grinding tool (A) is provided for. Tools (A) is not in contact with the surface to be polished. Tools (A) of the present invention is not provided with a moving member is made of stainless steel, some elements are ceramic materials. By the hydrodynamic characteristics, it is possible to achieve high-precision polishing the surface of optical quality. Tools (A) is stable and uniform and parallel to the workpiece surface to produce a repetitive annular grinding zone and generates a high speed flow rate spread radially. Structure of the tool is, enables the bath from the polishing process to achieve the optical surface, without having to exchange the tool to a final fine grinding process and tool wear, as well as to prevent the friction of the workpiece surface. Tool of the present invention can be polished thin film, and does not require a rigid or active support for the workpiece surface. The present invention reduces the cost as compared to other known methods, and greatly simplify the optical polishing step.
机译:Joe对平面或曲面进行精细研磨和精密抛光,以及对半导体和金属表面进行光学平面化处理。提供了有用的研磨工具(A)。工具(A)没有与要抛光的表面接触。本发明的工具(A)不具有由不锈钢制成的移动构件,一些元件是陶瓷材料。通过流体动力学特性,可以实现光学质量的高精度抛光。工具(A)稳定且均匀且平行于工件表面,以产生重复的环形磨削区域并产生沿径向散布的高速流速。工具的结构是,使镀液从抛光过程中获得光学表面,而不必将工具更换为最终的精细研磨过程和工具磨损,以及防止工件表面的摩擦。本发明的工具可以是抛光的薄膜,并且不需要对工件表面的刚性或主动支撑。与其他已知方法相比,本发明降低了成本,并且大大简化了光学抛光步骤。

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