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HYDRODYNAMIC RADIAL FLUX TOOL FOR POLISHING AND GRINDING OPTICAL AND SEMICONDUCTOR SURFACES
HYDRODYNAMIC RADIAL FLUX TOOL FOR POLISHING AND GRINDING OPTICAL AND SEMICONDUCTOR SURFACES
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机译:用于抛光和研磨光学和半导体表面的水力径向通量工具
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摘要
Joe fine grinding and precision polishing of flat or curved surfaces, as well as optical planarization of semiconductor and metal surfaces Useful grinding tool (A) is provided for. Tools (A) is not in contact with the surface to be polished. Tools (A) of the present invention is not provided with a moving member is made of stainless steel, some elements are ceramic materials. By the hydrodynamic characteristics, it is possible to achieve high-precision polishing the surface of optical quality. Tools (A) is stable and uniform and parallel to the workpiece surface to produce a repetitive annular grinding zone and generates a high speed flow rate spread radially. Structure of the tool is, enables the bath from the polishing process to achieve the optical surface, without having to exchange the tool to a final fine grinding process and tool wear, as well as to prevent the friction of the workpiece surface. Tool of the present invention can be polished thin film, and does not require a rigid or active support for the workpiece surface. The present invention reduces the cost as compared to other known methods, and greatly simplify the optical polishing step.
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