首页> 外国专利> HYDRODYNAMIC RADIAL FLUX TOOL FOR POLISHING AND GRINDING OPTICAL AND SEMICONDUCTOR SURFACES

HYDRODYNAMIC RADIAL FLUX TOOL FOR POLISHING AND GRINDING OPTICAL AND SEMICONDUCTOR SURFACES

机译:用于抛光和研磨光学和半导体表面的水力径向通量工具

摘要

A polishing tool useful for grinding and high precision, fine polishing of flat or curved optical surfaces, as well as for the optical flattening of semiconductor and metallic surfaces is presented. The tool does not make contact with the surface to be polished. The invention is a tool lacking moving parts, made of stainless steel and ceramic materials for some of its parts. Due to its hydrodynamic characteristics, it is possible to achieve polished surfaces of high-precision optical quality. The tool produces a high velocity flux that expands radially and parallel to the working surface generating a stable, uniform and repeatable annular abrasion footprint.;The design of the tool allows to attain an optical surface from the grinding process up to the final fine polishing process without having to change the tool, avoiding friction against the work surface as well as tool wear. It can polish thin membranes and does not require a rigid or active support for the working surface. This invention considerably simplifies optical polishing processes and reduces costs with respect to other known methods.
机译:提出了一种抛光工具,该抛光工具可用于对平面或曲面光学表面进行打磨和高精度,精细抛光,以及对半导体和金属表面进行光学平坦化。该工具不与要抛光的表面接触。本发明是一种缺少运动部件的工具,其一些部件由不锈钢和陶瓷材料制成。由于其流体力学特性,可以实现高精度光学质量的抛光表面。该工具产生高速通量,该通量沿径向延伸并平行于工作表面,从而产生稳定,均匀且可重复的环形磨损痕迹;该工具的设计允许从研磨过程到最终精细抛光过程获得光学表面。无需更换工具,避免了与工作表面的摩擦以及工具磨损。它可以抛光薄膜,不需要刚性或主动支撑的工作表面。相对于其他已知方法,本发明大大简化了光学抛光工艺并降低了成本。

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