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New Perspectives in Hydrodynamic Radial Polishing Techniques for Optical Surfaces

机译:光学表面流体动力径向抛光技术的新观点

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摘要

In order to overcome classic polishing techniques, a novel hydrodynamic radial polishing tool (HyDRa) is presented; it is useful for the corrective lapping and fine polishing of diverse materials by means of a low-cost abrasive flux and a hydrostatic suspension system that avoids contact of the tool with the working surface. This tool enables the work on flat or curved surfaces of currently up to two and a half meters in diameter. It has the advantage of avoiding fallen edges during the polishing process as well as reducing tool wear out and deformation. The functioning principle is based on the generation of a high-velocity, high-pressure, abrasive emulsion flux with radial geometry. The polishing process is repeatable by means of the control of the tool operational parameters, achieving high degrees of precision and accuracy on optical and semiconductor surfaces, with removal rates of up to 9 mm~3/hour and promising excellent surface polishing qualities. An additional advantage of this new tool is the possibility to perform interferometric measurements during the polishing process without the need of dismounting the working surface. A series of advantages of this method, numerical simulations and experimental results are described.
机译:为了克服经典的抛光技术,提出了一种新型的流体动力径向抛光工具(HyDRa)。它通过低成本磨料流和静液压悬挂系统,可避免工具与工作表面的接触,对各种材料进行正确的研磨和精细抛光,非常有用。该工具可以在目前最大直径为两米半的平面或曲面上进行加工。它具有避免在抛光过程中掉落边缘以及减少工具磨损和变形的优点。功能原理是基于产生具有径向几何形状的高速,高压磨料乳剂通量。抛光过程可通过控制工具操作参数进行重复,从而在光学和半导体表面上实现高度的精确度和准确性,去除率高达9 mm〜3 /小时,并有望表现出出色的表面抛光质量。这种新工具的另一个优点是可以在抛光过程中进行干涉测量,而无需拆卸工作表面。描述了该方法的一系列优点,数值模拟和实验结果。

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