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WIRE BONDING MONITORING APPARATUS AND WIRE BONDER AND METHOD FOR MONITORING BONDING HEIGHT OF WIRE BALL
WIRE BONDING MONITORING APPARATUS AND WIRE BONDER AND METHOD FOR MONITORING BONDING HEIGHT OF WIRE BALL
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机译:焊线监测装置和焊线以及监测焊球粘结高度的方法
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摘要
PURPOSE: A wire bonding monitoring apparatus and a wire bonder and a method for monitoring bonding height of a wire ball are provided to monitor whether the height of wire ball boned with a chip pad is a range of a reference bonding height or not. CONSTITUTION: A wire bonding monitoring apparatus includes a measurement apparatus and a controller(220). The measurement apparatus measures the bonding height of the wire ball bonded on the top surface of the chip pad(50). A controller is electrically connected to the measurement apparatus, and a controller judges whether the bonding value is between the range of the reference value or not. The wire bonding machine includes a bonding tool(100) and a wire bonding monitoring apparatus.
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