首页> 外国专利> MANUFACTURING METHOD OF METAL COPPER CLAD LAMINATE FOR VOLTAGE TEST AND THE METAL CCL THEREOF

MANUFACTURING METHOD OF METAL COPPER CLAD LAMINATE FOR VOLTAGE TEST AND THE METAL CCL THEREOF

机译:电压测试用金属铜复合板的制造方法及其金属覆铜板

摘要

PURPOSE: A manufacturing method of a metal copper foil laminate plate for a voltage withstand test and a metal copper foil laminate plate manufactured by the same are provided to improve the accuracy and reliability of a voltage withstand test. CONSTITUTION: Metal copper foil laminate plates are consecutively inputted. An edge part of a copper foil layer(12) is removed at a specific width by a pair of cutting tools(20) or grinding tools installed on both sides of a feeding direction of metal copper foil laminate plates, and a copper foil eliminator(14) is formed. Metal copper foil laminates are rotated at 90 degrees or converted in a right angle direction. The edge part of the both sides copper foil layer of the metal copper foil laminate plates is removed at a specific width by a pair of cutting tools or grinding tools, and a copper foil eliminator is formed. The copper foil layer of four sides edge part of the metal copper foil laminate plates is all removed and a voltage withstand test is performed.
机译:目的:提供一种用于耐压测试的金属铜箔层压板的制造方法和由其制造的金属铜箔层压板,以提高耐压测试的准确性和可靠性。组成:金属铜箔层压板是连续输入的。铜箔层(12)的边缘部分通过安装在金属铜箔层压板的进给方向两侧的一对切割工具(20)或研磨工具和铜箔消除器(特定宽度)去除。 14)形成。金属铜箔层压板旋转90度或沿直角方向转换。用一对切削工具或研磨工具将金属铜箔层叠板的两面铜箔层的端部以一定的宽度除去,从而形成除铜器。除去金属铜箔层叠板的四个侧缘部的铜箔层,进行耐压试验。

著录项

  • 公开/公告号KR101237243B1

    专利类型

  • 公开/公告日2013-02-26

    原文格式PDF

  • 申请/专利权人 AJUSTEEL CO. LTD.;

    申请/专利号KR20120012976

  • 发明设计人 RYU SI HAN;PARK HYUNG CHUL;

    申请日2012-02-08

  • 分类号G01R31/12;

  • 国家 KR

  • 入库时间 2022-08-21 16:25:39

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