COMPOSITE METAL FOIL COPPER-CLAD LAMINATE USING THE COMPOSITE METAL FOIL AND MANUFACTURING METHOD OF THE COPPER-CLAD LAMINATE

摘要

(Task) A copper-clad laminate in which a very thin, dense, and ultra-thin copper layer in which pinholes are unlikely to be laminated can be manufactured by a simple method, and a circuit is formed by an additive method using the ultra-thin copper layer as a seed layer. If it is, the seed layer can be etched and removed in a short time, so that etching to the circuit can be suppressed, and when a multi-layered substrate is manufactured using the copper-clad laminate, the entire multi-layered substrate is suppressed from being thickened, and a high-density multi-layer A composite metal foil that can be used as a substrate is provided. (Solution) A first Ni or Ni alloy layer is laminated on at least one surface of the metal foil carrier and the metal foil carrier, and a release layer, a second Ni layer, and an ultrathin layer are formed on at least one surface of the first Ni or Ni alloy layer. A composite metal foil in which a copper layer is laminated in this order, the primary particle diameter of the copper particles of the ultra-thin copper foil layer is 10 to 200 nm, the adhesion amount is 300 to 6000 mg/m 2, and the thickness of the second Ni layer is 0.3 to 5 Composite metal foil of µm.