LED PACKAGE WITH INTERFACIAL DEBONDING REDUCED

摘要

The present invention relates to an LED package to the outside, the LED chip is located in the opening from the inside of the package body, by providing a water passage led further, by the expansion of water by the heat discharged to the outside through the water passage, the problems of the prior art, to provide a package body and reduce the interfacial delamination between the LED package bag member . ; LED package according to the invention for this purpose and a lead frame is provided for applying a current to the LED chip, is formed to support the lead frame, an opening formed in the periphery of the LED chip and a package body which, with the resin sealing member formed in the opening of the package body; Along the interface between the package body and the sealing member or between the package body and the lead frame, and a water passageway leading from the interior of the opening to the outside of the package body.