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LEAD-FREE SOLDER ALLOY SUPPRESSED IN OCCURRENCE OF SHRINKAGE CAVITY
LEAD-FREE SOLDER ALLOY SUPPRESSED IN OCCURRENCE OF SHRINKAGE CAVITY
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机译:出现缩孔时抑制了无铅焊料合金
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摘要
A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1 - 1.5 %, Bi: 2.5 - 5.0 %, Cu: 0.5 - 1.0 %, optionally Ni: 0.015 - 0.035 % and/or at least one of Ge and Ga: 0.0005 - 0.01 %, and a remainder of Sn and unavoidable impurities.
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