The use of an emission from the wafer can be independent active wafer temperature may generally device, method, apparatus and the machine readable medium

摘要

A method with:Selecting a edge support (120) from a plurality of support beams with a plurality of different emission capability for use in a wafer processing device, wherein the selecting a tuning of a heating rate of the selected edge support (120) with a heating rate of a wafer formed thereon with a plurality of devices or parts of devices; thenCooling a on the edge supports (120) of a machining wafer edge resting in the case of a first heating of the machining wafer; thenMachining or forming a plurality of devices or parts of devices on the machining wafer; and thenHeating of the machining wafer with the plurality of devices or parts of the devices in the case of a second heating.