Semiconductor component for use in e.g. power electronic area, has solderable layers formed at surfaces of carrier and cooling body, respectively, where surfaces of carrier and body face body and carrier, respectively

摘要

The component (10) has a carrier (4) provided with strip conductors (5), electronic components and a ceramic substrate. A cooling body (1) i.e. heat sink, is heat conductively connected with the carrier, and two solderable layers (9, 2) are formed at surfaces of the carrier and the cooling body, where the surfaces of the carrier and body face the body and the carrier, respectively. The layers are connected with each other by a soldering process, and the body is made of aluminum material, where one of the layers is applied on the material by cold gas spraying of copper. The electronic components are designed as electrical resistors (8), capacitors, inductors, diodes, MOSFETs (6) or integrated switching circuits. An independent claim is also included for a method for manufacturing a component.