Circuit carrier e.g. direct bonded copper substrate, for fixing power transistors in e.g. circuit device of power-electronic system of vehicle, has cooling structure formed of heat conductive layer applied on surface of carrier layer

摘要

The carrier (100) has a cooling structure (120) arranged on a surface (110a) of a carrier layer (110) for cooling the carrier. The cooling structure is formed of a heat conductive layer by etching process, where the heat conductive layer is applied on the surface of the carrier layer. Electrical strip conductors (131, 132) are arranged on another surface (110b) of the carrier layer. The cooling structure includes a pin-shaped structural element (121) that enlarges the surface of the cooling structure and/or generates turbulences (320) with the coolants (310) flowing through the structure. Independent claims are also included for the following: (1) a circuit device (2) a method for manufacturing a circuit carrier.