Circuit carrier of circuit device has supporting layer having surface on which cooling structure is formed for cooling circuit carrier by directly plating on surface of supporting layer

摘要

The circuit carrier (100) has supporting layer (110) having first surface (110a) on which a cooling structure (120) is formed for cooling the circuit carrier by directly plating on the surface (110a) of the supporting layer. An electrical conductor (131,132) is formed on the second surface (110b) of the supporting layer by electroplating on the surface (110b) of the supporting layer. An independent claim is included for method for manufacturing circuit carrier.