Solder material, the use of the solder material in a solder paste, as well as a process for the preparation of a soldered connection with the aid of the solder material

摘要

The invention relates to a solder paste comprising a mixture of nanocrystalline metallic and / or constituting as well as oxidic particles, wherein the nanoparticles may possess a mean diameter of between 1 and 1000 nm, in particular between 2 to 500 nm. The mixture is reacted in each case after ignition by a heating coil completely and itself prop agie rend by, in a similar manner as in a thermite.By means of the selected ratio of metal, or constituting and oxidic particles and the choice of the particle sizes, the solder reaction and thus the soldering result controlling and advantageous to the problem of the components to be joined so that particularly in the case of temperature sensitive components of advantage is.