首页> 外国专利> Identifiable multilayer printed circuit board has antenna that is formed in inner layer and is electrically connected with RFID chip through contact terminals formed in mother board to form RFID transponder

Identifiable multilayer printed circuit board has antenna that is formed in inner layer and is electrically connected with RFID chip through contact terminals formed in mother board to form RFID transponder

机译:可识别的多层印刷电路板具有形成在内层中的天线,并通过母板上形成的接触端子与RFID芯片电连接以形成RFID应答器

摘要

The printed circuit board (1) has inner layer (1b) between outer layers (1a,1c). A prefabricated mother board (3) mounted with a RFID chip (4) is arranged between the outer layer (1a) and inner layer such that the RFID chip is located in a recess (7) formed in the inner layer. An antenna (2) is formed in the inner layer and is electrically connected with the RFID chip through the contact terminals formed in the mother board to form a RFID transponder. The connection between the antenna and RFID chip is formed by crimping, soldering, laser welding, gluing or pressing. An independent claim is included for manufacturing method of printed circuit board.
机译:印刷电路板(1)在外层(1a,1c)之间具有内层(1b)。安装有RFID芯片(4)的预制母板(3)布置在外层(1a)和内层之间,使得RFID芯片位于形成在内层中的凹部(7)中。天线(2)形成在内层中,并通过形成在母板上的接触端子与RFID芯片电连接,以形成RFID应答器。天线和RFID芯片之间的连接是通过压接,焊接,激光焊接,胶合或压制形成的。包括独立权利要求的印刷电路板的制造方法。

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