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Effects of printed circuit board on the performance of tag antennas for passive RFID

机译:印刷电路板对无源RFID标签天线性能的影响

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This article presents a study of the effects that an UHF (Ultra High Frequency) Passive RFID (Radio Frequency Identification) tag suffers when inserted on a PCB (Printed Circuit Board). The normal tags when are glued to electronic boards, they suffer from degradation in performance due to the presence of the metals plans and the respective traces and vias present in the electronics projects. The objective of this study is to identify the main features that should be considered in RFID UHF tags projects designs on printed circuit boards and develop a method to insert UHF RFID tags on PCBs. It was used here a folded dipole. First of all, it is shown the designs performance out of the PCB, without metals planes, traces and vias interference. After the design modeling, it was carried out simulations on CST to optimize the projects for one and two layers PCBs, working with the thickness of the cooper and the PCBs dielectric, the tag position on the PCB and the antennas parameters to attain impedance matching with IC (Integrated Circuit). Finally, it was manufactured one and two layers PCBs with the RFID tags to test in anechoic RF chamber. The results show that if the antenna design was developed with the methods described on this study, the strong influence of the PCB metals parts on tags performance will be reduced significantly and the manufacture of RFID tags on electronics boards become possible.
机译:本文介绍了将UHF(超高频)无源RFID(射频识别)标签插入PCB(印刷电路板)时会遭受的影响的研究。普通标签粘贴到电子板上时,由于金属计划以及电子项目中存在的相应走线和过孔的存在,它们的性能会下降。这项研究的目的是确定在印刷电路板上的RFID UHF标签项目设计中应考虑的主要特征,并开发一种在PCB上插入UHF RFID标签的方法。在此使用了折叠偶极子。首先,它显示了PCB之外的设计性能,没有金属平面,走线和过孔的干扰。设计建模后,在CST上进行了仿真,以优化一层和两层PCB的项目,并使用铜的厚度和PCB的电介质,PCB上的标签位置以及天线参数来实现阻抗匹配。 IC(集成电路)。最后,制造出带有RFID标签的一层和两层PCB,以便在消声RF室中进行测试。结果表明,如果采用本研究中描述的方法开发天线设计,则将大大减少PCB金属部件对标签性能的强烈影响,并且有可能在电子板上制造RFID标签。

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