首页> 外国专利> Seamless audio-headphone set for e.g. instance smartphone, has ear piece portion designed as extension of insulating material of body such that ear piece arrangement represents seamless transition from cable portion to piece portion

Seamless audio-headphone set for e.g. instance smartphone, has ear piece portion designed as extension of insulating material of body such that ear piece arrangement represents seamless transition from cable portion to piece portion

机译:无缝音频耳机套装,例如例如智能手机,其耳塞部分设计为主体绝缘材料的延伸,从而使耳塞布置代表从电缆部分到耳塞部分的无缝过渡

摘要

The headphone set (100) has an ear piece arrangement (102) comprising a ribbon cable portion (110) and an ear piece portion (112). The ribbon cable portion comprises a body and multiple elongated conductors i.e. copper wire coil, where the body is made of an electrically insulating material. The ear piece portion is extended from a distal extremity of the body and designed as an adjacent extension of the insulating material of the body such that the ear piece arrangement represents a seamless transition from the ribbon cable portion to the ear piece portion. Independent claims are also included for the following: (1) a method for manufacturing a seamless headphone set (2) a system for manufacturing a seamless headphone set.
机译:耳机组(100)具有包括带状电缆部分(110)和耳机部分(112)的耳机装置(102)。带状电缆部分包括主体和多个细长导体,即铜线线圈,其中主体由电绝缘材料制成。耳机部分从主体的远端延伸并且被设计为主体的绝缘材料的相邻延伸部,使得耳机布置表示从带状电缆部分到耳机部分的无缝过渡。还包括以下方面的独立权利要求:(1)制造无缝耳机组的方法(2)制造无缝耳机组的系统。

著录项

  • 公开/公告号DE102012216922A1

    专利类型

  • 公开/公告日2013-03-28

    原文格式PDF

  • 申请/专利权人 HTC CORPORATION;

    申请/专利号DE201210216922

  • 发明设计人 STEPHENSON SHAWN MICHAEL;

    申请日2012-09-20

  • 分类号H04R5/033;

  • 国家 DE

  • 入库时间 2022-08-21 16:21:39

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