Power module having is connected directly, thermally conductive structures

摘要

A power module contains a substrate with an electrically insulating element with a first metal-coated side and an opposite second metal-coated side and one or several semiconductor chips, which on the first metal coated side of the substrate are fastened. A plurality of thermally conductive structures is laterally spaced from each other and individually directly on the second metallized side of the substrate, so that the plurality of thermally conductive structures of the second metallized side projects outward.