首页>
外国专利>
MOLDING COMPONENT, MANUFACTURING APPARATUS OF MOLDING COMPONENT, PORTABLE ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF MOLDING COMPONENT
MOLDING COMPONENT, MANUFACTURING APPARATUS OF MOLDING COMPONENT, PORTABLE ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF MOLDING COMPONENT
展开▼
机译:模具零件,模具零件的制造装置,便携式电子设备以及模具零件的制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide a molding component in which the length of a contact pin for bringing a first surface and a second surface of a housing into electrical conduction with each other can be made short, and a manufacturing apparatus and manufacturing method for the molding component.;SOLUTION: A manufacturing apparatus 50 of a molding component 60 having a contact pin 300 for bringing a first surface 21 and a second surface 22 of a housing 20 into electrical conduction with each other includes a first mold 51 and a second mold 52 arranged to face the first mold 51. The first mold 51 includes a supporting part 511 which supports, from the inside of the contact pin 300, a concave part 310 mounted at the first mold 51 side of the contact pin 300 on a mold surface 51a. Regarding the second mold 52, when the second mold 52 is moved to a first mold position with respect to the first mold 51, molding material can be poured between the first mold 51 and the second mold 52, and when the second mold 52 is moved to a second mold position with respect to the first mold 51, a mold component 60 in which the contact pin 300 is embedded can be taken out.;COPYRIGHT: (C)2014,JPO&INPIT
展开▼