首页> 外国专利> Support device manufacturing method, involves partially molding electrically conductive components of hybrid component with plastic, and support device is injected into pins during molding process while manufacturing hybrid component

Support device manufacturing method, involves partially molding electrically conductive components of hybrid component with plastic, and support device is injected into pins during molding process while manufacturing hybrid component

机译:支撑装置的制造方法,涉及用塑料部分地模制混合部件的导电部件,并且在制造混合部件的同时在模制过程中将支撑装置注入销中。

摘要

The method involves partially molding electrically conductive components (15) of a hybrid component (14) with plastic. Electrical contact pins (8-12) are arranged adjacent to each other in groups, where the contact pins protrude outwards via the hybrid component. A support device (1) is injected into the contact pins during the molding process while manufacturing the hybrid component. The contact pins are clamped using receiving grooves of the support device.
机译:该方法包括用塑料部分地模制混合部件(14)的导电部件(15)。电触针(8-12)成组彼此相邻布置,其中触针通过混合组件向外突出。在制造混合组件时,在模制过程中将支撑装置(1)注入到接触销中。接触销通过支撑装置的容纳槽夹紧。

著录项

  • 公开/公告号DE102006014951B3

    专利类型

  • 公开/公告日2007-08-09

    原文格式PDF

  • 申请/专利权人 HANS HUONKER GMBH;

    申请/专利号DE20061014951

  • 发明设计人 HUONKER HANS-GEORG;

    申请日2006-03-31

  • 分类号H01R43/24;H01R13/42;

  • 国家 DE

  • 入库时间 2022-08-21 20:29:18

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