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BACKSIDE IRRADIATION IMAGE SENSOR DEVICE INTEGRATED IN LENGTHWISE DIRECTION

机译:沿长度方向集成的背面辐射图像传感器装置

摘要

PROBLEM TO BE SOLVED: To provide a backside irradiation image sensor device integrated in the lengthwise direction.SOLUTION: A backside irradiation image sensor includes a photodiode and a first transistor located in a first chip and the first transistor is electrically coupled to the photodiode. Furthermore, the backside irradiation image sensor includes a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip, the second chip is laminated with the first chip, and the third chip is laminated with the second chip. The logic circuit, the second transistor, and the first transistor are coupled to each other through a plurality of bonding pads and a penetration via.
机译:解决的问题:提供在纵向方向上集成的背面照射图像传感器装置。解决方案:背面照射图像传感器包括光电二极管和位于第一芯片中的第一晶体管,并且第一晶体管电耦合至光电二极管。此外,背面照射图像传感器包括形成在第二芯片中的第二晶体管和形成在第三芯片中的多个逻辑电路,第二芯片与第一芯片层叠,并且第三芯片与第二芯片层叠。逻辑电路,第二晶体管和第一晶体管通过多个键合焊盘和穿透通孔彼此耦合。

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