It is arrayed by the direction which crosses the lithography

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for enhancing the overlay accuracy without impairing the processing capacity of a lithography apparatus significantly.;SOLUTION: Alignment marks on a substrate are inspected during exposure thereof in order to optimize the exposure conditions. When the substrate 10 is scanned directly under an exposure and alignment unit 15, each part of the substrate passes under a detector unit 16 at first, and then passes under an exposure unit 17. Consequently, the information about the linear position, orientation, and expansion measured by the detector unit 16 for each part of the substrate 10 can be transmitted to the exposure unit 17, and the exposure conditions for each part of the substrate can be optimized when the substrate is exposed while passing under the exposure unit 17.;COPYRIGHT: (C)2013,JPO&INPIT