The containing phosphor copper anode for electric copper plating, in the production manner and the containing phosphor copper

摘要

PROBLEM TO BE SOLVED: To provide a phosphorus-containing copper anode for electrolytic copper plating, a method of producing the phosphorus-containing copper anode for electrolytic copper plating and an electrolytic copper plating method capable of reducing plating defectives due to slime.;SOLUTION: Working is performed onto a phosphorus-containing copper for electrolytic copper plating to give a working strain to the phosphorus-containing copper for electrolytic copper plating, thereafter, re-crystallizing heat treatment is performed, thereby, such a crystal grain boundary structure that the special grain boundary length rate Lσ_N/L_N of the unit total special grain boundary length Lσ_N calculated by converting the total special grain boundary length Lσ of a special grain boundary into the value per unit area 1 mm² to the unit total grain boundary length L_N calculated by converting the total grain boundary length L of a crystal grain boundary of a copper crystal grain on the anode surface into the value per unit area 1 mm² becomes 0.4 or more is produced, a black film is evenly formed on the initial time of electrolytic copper plating, the black film is prevented from coming off and, thereby, the plating defectives can be reduced.;COPYRIGHT: (C)2011,JPO&INPIT