Heat sink, cooling module and cooling an electronic board

摘要

PROBLEM TO BE SOLVED: To provide a heatsink, a cooling module and a coolable electronic substrate reducing temperature rise of a heating element (that is, increasing the cooling effect of the heating element) by effectively reducing the temperature gradient on a substrate without reducing durability and reliability.;SOLUTION: The heatsink 10 has the substrate 11 opposed to the heating element 14 to take off heat from the heating element 14. In the substrate 11, the heat resistance of a part 12 opposed to the heat element 14 is higher than that of a part 13 surrounding the opposed part 12.;COPYRIGHT: (C)2009,JPO&INPIT