Die bond material for optical semiconductor device and optical semiconductor device using the same

摘要

PROBLEM TO BE SOLVED: To provide a die-bonding material for optical semiconductor devices, with which bondability during wire bonding is improved and the thermal cracking resistance of a cured material is enhanced.SOLUTION: The die-bonding material for optical semiconductor devices includes: a first silicone resin represented by formula (1) and having an aryl group and a hydrogen atom bonded to silicon atom; a second silicone resin represented by formula (51), having no hydrogen atom bonded to silicon atom and having an aryl group and alkenyl group; a catalyst for hydrosilylation reaction; and silicon oxide particles. In the die-bonding material for optical semiconductor devices, the first silicone resin has no dimethylsiloxane skeleton and the second silicone resin has no dimethylsiloxane skeleton.