Being manner in order to burble the portion of the surface of specification of

摘要

The invention relates to a method for partially stripping a defined area of a conductive layer from a substrate (1). For this purpose, in a first method step, the area is firstly subdivided into regions (4) by means of a laser beam (3). For this purpose, the laser beam parameters are set in such a way that only the conductive layer is removed, without the underlying substrate (1) that carries the conductive layer also being impaired at the same time in the process. For this purpose, each of these strip-shaped regions (4) is thermally insulated from the adjoining regions (4) of the conductive layer by the introduction of a linear cutout (5) along a respective periphery of the regions (4). For this purpose, the cutouts (5) are introduced as substantially parallel straight lines that form an acute angle (α) of 22.5° with the principal axes (X, Y) determined by the known course of the conductor track (2). In this way, a parallel course of the cutouts (5) with respect to a conductor track (2) is approximately precluded in practice, such that a thermal energy input parallel to the conductor track (2) during the process of stripping away the region (4) adjacent to the conductor track (2) and thus damage to the latter are avoided. In a subsequent method step, the regions (4) are removed upon simultaneous heating by means of a fluid flow, the orientation of which relative to the cutouts (5) is set in such a way that the fluid flow impinges on the cutouts (5) neither parallel nor orthogonally.