APPARATUSES AND METHODS FOR EXTRACTING DEFECT DEPTH INFORMATION AND METHODS OF IMPROVING SEMICONDUCTOR DEVICE MANUFACTURING PROCESSES USING DEFECT DEPTH INFORMATION

摘要

Apparatuses and methods for extracting defect depth information and methods of improving semiconductor device manufacturing processes using defect depth information are provided. The apparatuses may include an inspection assembly configured to obtain a plurality of optical images of a portion of an inspection object including a defect along a depth direction and a processor circuit configured to generate defect data using the plurality of optical images and provide defect depth information by comparing the defect data with comparison data in a library database.