首页>
外国专利>
CHEMICAL MECHANICAL POLISHING METHODS AND SYSTEMS INCLUDING PRE-TREATMENT PHASE AND PRE-TREATMENT COMPOSITIONS
CHEMICAL MECHANICAL POLISHING METHODS AND SYSTEMS INCLUDING PRE-TREATMENT PHASE AND PRE-TREATMENT COMPOSITIONS
展开▼
机译:化学机械抛光方法和系统,包括前处理阶段和前处理组成
展开▼
页面导航
摘要
著录项
相似文献
摘要
In one aspect, a substrate chemical mechanical polishing (CMP) method for copper-layered substrates is disclosed. The CMP method includes providing a substrate having a surface of copper, and pre-treating the surface containing copper with a first composition containing a carrier liquid, a corrosion inhibitor, and an oxidizer in a pre-treatment phase, and thereafter, polishing the surface with a slurry composition in a main polishing phase. CMP systems and compositions for CMP are provided, as are numerous other aspects.
展开▼