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Lateral Power Semiconductor Device and Method for Manufacturing a Lateral Power Semiconductor Device

机译:横向功率半导体器件及制造横向功率半导体器件的方法

摘要

A lateral power semiconductor device includes a semiconductor body having a first surface and a second opposite surface, a first main electrode, a second main electrode, a plurality of switchable semiconductor cells and at least one curved semiconductor portion. The first main electrode includes at least two sections and is arranged on the first surface. The second main electrode is arranged on the first surface and between the two sections of the first main electrode. The plurality of switchable semiconductor cells is arranged between a respective one of the two sections of the first main electrode and the second main electrode and is configured to provide a controllable conductive path between the first main electrode and the second main electrode. The curved semiconductor portion is between the first main electrode and the second main electrode and has increasing doping concentration from the first main electrode to the second main electrode.
机译:横向功率半导体器件包括具有第一表面和第二相对表面的半导体本体,第一主电极,第二主电极,多个可切换半导体单元和至少一个弯曲半导体部分。第一主电极包括至少两个部分并且布置在第一表面上。第二主电极布置在第一主电极的第一表面上和两个部分之间。多个可切换半导体单元布置在第一主电极和第二主电极的两个部分中的相应一个之间,并且被配置为在第一主电极和第二主电极之间提供可控制的导电路径。弯曲的半导体部分在第一主电极和第二主电极之间,并且从第一主电极到第二主电极具有增加的掺杂浓度。

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