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METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND INTERPOSER AND HYBRID WIRING BOARD MANUFACTURED THEREBY
METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND INTERPOSER AND HYBRID WIRING BOARD MANUFACTURED THEREBY
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机译:用内置式加劲板和中介层制造混合接线板的方法及其制造的混合接线板
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摘要
The present invention relates to a method of making a hybrid wiring board. In accordance with a preferred embodiment, the method includes: preparing a dielectric layer and a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier and the dielectric layer covers the supporting board; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; then mounting an interposer into the cavity; and then forming a build-up circuitry that includes a first conductive via in direct contact with the interposer and provides signal routing for the interposer. Accordingly, the direct electrical connection between the interposer and the build-up circuitry is advantageous to high I/O and high performance, and the stiffener can provide adequate mechanical support for the build-up circuitry and the interposer.
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