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Scalable hardware architecture, scalable cooling system, and convection-cooled electrical circuit

机译:可扩展的硬件体系结构,可扩展的冷却系统和对流冷却电路

摘要

A unified scalable hardware system architecture contains subsystems which can be made available to a user depending on demand, a status of user's subscription or on a level of acquired licenses. This allows achieving manufacturing economies of scale with flexible monetization policies depending on the subscribed service level.;An electric circuit such as a microprocessor system or a semiconductor control device includes a set of channels coupled to a source of a cooling medium and to an external heat exchanger. This cooling medium may be composed of a single or multi-phase liquid, gas, or mixture of any of the said media with solid particles flowing within an integrated circuit (IC) enclosure tangent to the said IC or across the integrated circuit structure through a set of microchannels.;A scalable microprocessor system adjusts the number of active cores to the capability of a docking station to dissipate waste heat. In the absence of an active external heat sink, the number of active cores is reduced to limit the core temperatures to predefined values.
机译:统一的可伸缩硬件系统体系结构包含子系统,这些子系统可以根据需求,用户订阅的状态或所获取许可证的级别提供给用户。这允许根据订阅的服务级别通过灵活的货币政策实现制造规模经济。诸如微处理器系统或半导体控制设备之类的电路包括一组通道,这些通道耦合到冷却介质的来源和外部热量。交换器。该冷却介质可以由单相或多相液体,气体,或任何上述介质与在与该IC相切的集成电路(IC)外壳内流动或通过集成电路横穿集成电路结构的固体颗粒的混合物组成。一套可扩展的微处理器系统可调整活动核心的数量,以适应​​扩展坞散发废热的能力。在没有活动的外部散热器的情况下,活动核心的数量将减少,以将核心温度限制为预定值。

著录项

  • 公开/公告号US2013329355A1

    专利类型

  • 公开/公告日2013-12-12

    原文格式PDF

  • 申请/专利权人 MICHAL POLUBINSKI;

    申请/专利号US201313916548

  • 发明设计人 MICHAL POLUBINSKI;

    申请日2013-06-12

  • 分类号G06F1/20;

  • 国家 US

  • 入库时间 2022-08-21 16:07:11

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