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Integration of germanium photo detector in CMOS processing

机译:锗光电探测器在CMOS处理中的集成

摘要

A method and device are provided for forming an integrated Ge or Ge/Si photo detector in the CMOS process by non-selective epitaxial growth of the Ge or Ge/Si. Embodiments include forming an N-well in a Si substrate; forming a transistor or resistor in the Si substrate; forming an ILD over the Si substrate and the transistor or resistor; forming a Si-based dielectric layer on the ILD; forming a poly-Si or a-Si layer on the Si-based dielectric layer; forming a trench in the poly-Si or a-Si layer, the Si-based dielectric layer, the ILD, and the N-well; forming Ge or Ge/Si in the trench; and removing the Ge or Ge/Si, the poly-Si or a-Si layer, and the Si-based dielectric layer down to an upper surface of the ILD. Further aspects include forming an in-situ doped Si cap epilayer or an ex-situ doped poly-Si or a-Si cap layer on the Ge or Ge/Si.
机译:提供了一种用于通过CMOS或Ge / Ge / Si的非选择性外延生长在CMOS工艺中形成集成的Ge或Ge / Si光电探测器的方法和装置。实施例包括在Si衬底中形成N阱;在Si衬底中形成晶体管或电阻器;在Si衬底和晶体管或电阻器上形成ILD;在ILD上形成Si基介电层;在基于硅的介电层上形成多晶硅或非晶硅层;在多晶硅或非晶硅层,硅基介电层,ILD和N阱中形成沟槽;在沟槽中形成Ge或Ge / Si;并去除所述Ge或Ge / Si,多晶硅或非晶硅层以及所述硅基介电层直到所述ILD的上表面。其他方面包括在Ge或Ge / Si上形成原位掺杂的Si帽外延层或异位掺杂的多晶硅或a-Si帽层。

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