Electro-thermal cooling devices and methods of fabrication thereof

摘要

In one embodiment, a semiconductor module includes a leadframe having a first side and an opposite second side. A semiconductor chip is disposed over the first side of the leadframe. A switching element is disposed under the second side of the leadframe. In another embodiment, a method of forming a semiconductor module includes providing a semiconductor device having a leadframe. A semiconductor chip is disposed over a first side of the leadframe. A switching element is attached at an opposite second side of the leadframe.