Numerical analysis of electro-thermal behavior and optimization of the cooling system in electronic power devices using CAD/CAE tools

摘要

Due to ongoing push of technology to smaller dimensions and higher computational speed of the electronic devices, a higher heat generation on device is obtained, increasing the thermal management challenges. This paper proposes a study of the electro-thermal behavior in electronic power devices and the optimization of the cooling system in order to increase the lifetime of the device. Different heat-sink designs for L298N Dual H-Bridge are proposed in this article. For each testing design of the heat sink two problems need to be solved: the electrical process model, which provides the power dissipation of the system, and the thermal process model, which provides the temperature distribution. The thermal analysis results and the optimal design of the heat sink are modeled using CAD/CAE specialized tools.