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LEADFRAME FOR INTEGRATED CIRCUIT DIE PACKAGING IN A MOLDED PACKAGE AND A METHOD FOR PREPARING SUCH A LEADFRAME
LEADFRAME FOR INTEGRATED CIRCUIT DIE PACKAGING IN A MOLDED PACKAGE AND A METHOD FOR PREPARING SUCH A LEADFRAME
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机译:用于模制封装中的集成电路芯片封装的引线框架以及制备这种引线框架的方法
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摘要
Embodiments of a method for preparing a leadframe for integrated circuit (IC) die packaging in a molded package with an exposed die pad are disclosed. In one embodiment, a method involves producing a leadframe with a die pad, wherein the die pad has a top surface, a bottom surface, and a perimeter edge. The die pad is then planarized to flatten burrs that may exist at the perimeter edge of the die pad, wherein planarizing the die pad comprises embedding tool markings in the die pad at the perimeter edge of the die pad, the tool markings including a series of peaks and valleys that run parallel to the perimeter edge at all locations around the perimeter edge. Embodiments of a leadframe for IC die packaging in a molded package are also disclosed.
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