首页> 外国专利> STRESS ENHANCED LDMOS TRANSISTOR TO MINIMIZE ON-RESISTANCE AND MAINTAIN HIGH BREAKDOWN VOLTAGE

STRESS ENHANCED LDMOS TRANSISTOR TO MINIMIZE ON-RESISTANCE AND MAINTAIN HIGH BREAKDOWN VOLTAGE

机译:应力增强型LDMOS晶体管可最小化导通电阻并保持高击穿电压

摘要

A lateral diffused metal-oxide-semiconductor field effect transistor (LDMOS transistor) employs a stress layer that enhances carrier mobility (i.e., on-current) while also maintaining a high breakdown voltage for the device. High breakdown voltage is maintained, because an increase in doping concentration of the drift region is minimized A well region and a drift region are formed in the substrate adjacent to one another. A first shallow trench isolation (STI) region is formed on and adjacent to the well region, and a second STI region is formed on and adjacent to the drift region. A stress layer is deposited over the LDMOS transistor and in the second STI region, which propagates compressive or tensile stress into the drift region, depending on the polarity of the stress layer. A portion of the stress layer can be removed over the gate to change the polarity of stress in the inversion region below the gate.
机译:横向扩散的金属氧化物半导体场效应晶体管(LDMOS晶体管)采用应力层,该应力层增强载流子迁移率(即,导通电流),同时还保持器件的高击穿电压。因为漂移区的掺杂浓度的增加被最小化,所以维持了高击穿电压。在彼此相邻的基板中形成阱区和漂移区。第一浅沟槽隔离(STI)区域形成在阱区域上并与其相邻,并且第二STI区域形成在漂移区域上并与漂移区域相邻。应力层沉积在LDMOS晶体管上方和第二STI区域中,该应力层根据应力层的极性将压缩应力或拉伸应力传播到漂移区中。可以在栅极上方去除应力层的一部分,以改变栅极下方反转区域中的应力极性。

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