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Semiconductor devices having reduced gate-drain capacitance

机译:栅漏电容减小的半导体器件

摘要

Embodiments of a semiconductor device include a semiconductor substrate having a first surface and a second surface opposed to the first surface, a trench formed in the semiconductor substrate and extending from the first surface partially through the semiconductor substrate, a gate electrode material deposited in the trench, and a void cavity in the semiconductor substrate between the gate electrode material and the second surface. A portion of the semiconductor substrate is located between the void cavity and the second surface.
机译:半导体器件的实施例包括:具有第一表面和与第一表面相对的第二表面的半导体衬底;形成在半导体衬底中并从第一表面部分地延伸穿过半导体衬底的沟槽;在沟槽中沉积的栅电极材料。以及在栅电极材料和第二表面之间的半导体衬底中的空腔。半导体衬底的一部分位于空隙腔与第二表面之间。

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