Multi-level integrated circuit, device and method for modeling multi-level integrated circuits

摘要

A multi-level integrated circuit, having a superposition of a first stack and a second stack of layers, and including a first row of electronic devices produced in the first stack, extending parallel to a first direction and fitting into a first volume with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H₁; a second row of electronic devices produced in the second stack, extending parallel to the first direction and fitting into a second volume with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H₂H₁; and a plurality of electrical connection elements passing through the second stack of layers, each connection element fitting into a third volume arranged on the first volume and next to the second volume.