Multi-level integrated circuit, device and method for modeling multi-level integrated circuits

摘要

A multi-level integrated circuit (1000) comprising a superposition of a first stack and a second stack of layers, and including:- a first row of electronic devices produced in the first stack, extending parallel to a first direction and fitting into a first volume (300) with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H₁;- a second row of electronic devices produced in the second stack, extending parallel to the first direction and fitting into a second volume (302) with a substantially parallelepiped rectangle shape and having edges perpendicular to the first direction and with dimension H₂ H₁;- a plurality of electrical connection elements passing through the second stack of layers, each connection element fitting into a third volume (304) arranged on the first volume and next to the second volume.