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Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut
Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut
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机译:用于多行引线框架的结构和能够最小化底切的半导体封装
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摘要
The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.
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