NEW SOLAR CELL EMTTER CONTACT GRID FORMING METHOD USING THE FULL CHEMICAL METALLIZATION COATING METHOD

摘要

The invention relates to the field of semiconductor devices, particularly in relation to the solar cells. This invention is a method to produce solar cell emitter grid, with low resistance and good adhesion at which can be easily connected to the connecting cables. To realize this aim, instead of silver creates two layers of nickel and copper chemically coated coating which covered Ni performs ohmic contact function of silicon and copper layer reduces the resistance of the grid. This allows reduce emitter alloying level and increase solar cell efficiency. This solar cell has the following characteristics: a lower cost; easier availability of used items; significantly lower grid tracks that not contouring thin solar cell plates and practically does not shadow, volume; opportunity to thin solar cells.