APPARATUS FOR MOULDING A HOUSING STRUCTURE FOR A PLURALITY OF ELECTRONIC COMPONENTS, AND A HOUSING STRUCTURE OF THIS KIND FOR A PLURALITY OF ELECTRONIC COMPONENTS

摘要

The invention discloses an apparatus for moulding a housing structure for a plurality of electronic components, and a housing structure for a plurality of electronic components. An apparatus for moulding a housing structure for a plurality of electronic components (7), wherein the apparatus has: a cavity plate (15) which is moulded in such a way that a respective housing frame (5) is formed during moulding for each electronic component (7), wherein the cavity plate (15) has at least one opening (14) for feeding a moulding composition (2); and a distributor structure (9) which is moulded in such a way that, during moulding, the moulding composition (2) is routed to at least one injection point by means of at least one feed channel (16), wherein the at least one injection point (8) is oriented to the at least one opening (14) in the cavity plate (15).