METAL FINGER CAPACITORS WITH HYBRID METAL FINGER ORIENTATIONS IN STACK WITH UNIDIRECTIONAL METAL LAYERS

摘要

A semiconductor die (104; 118) having a plurality of metal layers (106; 108; 110; 112; 114; 116; 120; 122; 124; 126; 128; 130), including a set of metal layers having a preferred direction for minimum feature size (112; 114; 116; 126; 128; 130). The set of metal layers are such that adjacent metal layers have preferred directions orthogonal to one another. Finger capacitors (204; 304) formed in the set of metal layers are such that a finger capacitor formed in one metal layer has a finger direction parallel to the preferred direction of that metal layer. In bidirectional metal layers (106; 108; 110; 120; 122; 124), capacitor fingers may be in either direction.