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Temperature compensated micro-electromechanical device and method of temperature compensation in a micro-electromechanical device
Temperature compensated micro-electromechanical device and method of temperature compensation in a micro-electromechanical device
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机译:温度补偿的微机电装置以及微机电装置中的温度补偿方法
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摘要
A micro-electromechanical device includes a semiconductor body (5), in which at least one first microstructure (2) and one second microstructure (3) of reference are integrated. The first microstructure (2) and the second microstructure (3) are arranged in the body (5) so as to undergo equal strains as a result of thermal expansions of said body (5; 105; 205; 305). Furthermore, the first microstructure (2) is provided with movable parts (6) and fixed parts (7) with respect to the body (5), and the second microstructure (3) has a shape that is substantially symmetrical to the first microstructure (2) and is fixed with respect to the body (5).
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