SURFACE-TREATED COPPER FOIL AND LAMINATE USING SAME, COPPER-CLAD LAMINATE, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

摘要

Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent resin transparency after removing the copper foil by etching, a laminate using the same, a copper-clad laminate, a printed circuit board, and an electronic device. A surface-treated copper foil having rough particles formed on at least one surface thereof as a result of a roughening treatment, wherein: a copper foil is adhered to both surfaces of a polyimide resin substrate; the copper foil on both surfaces is removed by etching; printed matter on which a linear mark is printed is spread under the exposed polyimide substrate; and an observation point/brightness graph prepared by measuring the brightness at each observation point in a direction perpendicular to the direction in which the observed linear mark extends, in an image obtained by imaging the printed matter using a CCD camera through the polyimide substrate, illustrates that the difference ΔB (ΔB=Bt-Bb) between the top average value (Bt) and the bottom average value (Bb) of a brightness curve produced from the end of the mark to a section not having the mark is 40 or higher.