ADDITIVE FOR COPPER ELECTROPLATING BATH, COPPER ELECTROPLATING BATH CONTAINING SAID ADDITIVE, AND COPPER ELECTROPLATING METHOD USING SAID COPPER ELECTROPLATING BATH

摘要

Heretofore, when copper is filled in fine grooves or holes (sometimes also referred to as "trenches" collectively, hereinafter) in a base to be coated, which has the tranches formed therein, by copper electroplating, there is a problem that voids are formed or copper is precipitated on regions other than the trenches.For the purpose of solving the problem, the present invention provides an additive for a copper electroplating bath, which comprises at least one high-molecular-weight compound which is selected from high-molecular-weight compounds each represented by general formula (1) or general formula (2) and has a weight average molecular weight of 20,000 to 10,000,000.(In the formulae, X represents at least one unit selected from units each represented by a specific structure; and the ratio of a to b, i.e., a:b, falls within the range from 10:90 to 99:1.)